Shhhh…

What the pulse plating rectifier manufactures don’t want you to know...

 

 

 

8:1 Aspect Ratio (2mm panel thickness X 0.25 mm hole dia.);
1:1 Surface to Hole ratio; 0.001” thickness at hole center; 18 ASF for 66 minutes.

 
With Cerambus’ 909 series of copper brighteners, you get pulse plating results, without the use of expensive pulse plating rectifiers. Simply put, the leveling capabilities of our brighteners are phenomenal. 909 brighteners can plate vias with aspect ratios up to 30:1 with only standard DC rectification! And because a 909 bath levels so well, you can plate even high aspect ratios quickly without the fear of “dog-boning” or closing off your vias. Furthermore, the physical properties of the copper plated with a 909 brightener are unmatched. Plating virtually 100% pure and with elongation results up to 30%, your copper will adhere to your PTH or alternative electroless plated vias, and won’t break or corner crack, even under the most challenging of Z-Axis expansion scenarios.

So ask your local Cerambus representative about running a 909 trial in your plant today. Just please keep it quiet; we still have a few friends left making pulse rectifiers, and we’d like to keep them….

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