C-BOND® 922 ALTERNATIVE OXIDE - Datasheet
The C-BOND® 922 process is a high performance alternative oxide that can be used in either vertical or horizontal equipment. This proven formulation allows for maximum bonding performance with a wide array of laminate systems.

ZELECTROLESS® 6080 PTH PROCESS - Datasheet
ZELECTROLESS® 6080 is a stable, room temperature, medium speed electroless copper process. The PTH bath itself contains only a minimal amount of formaldehyde, has a large operating window and good stability. The bath will produce a bright, dense deposit of copper metal on the surface and through the vias.

909BP® and 909® PANEL AND PATTERN PLATING BRIGHTENERS - More Information - Datasheets
Cerambus’ 909 series of copper brighteners produce ductile, low stressed deposits with consistent elongation and tensile strengths, assuring thermal shock reliability. The 909 brighteners allow for the plating of high aspect ratio vias without the use of expensive pulse plating rectifiers, or harmful, stress-inducing agents. The brighteners are also totally controllable via CVS analysis.

SN200M® MATTE and SN100® BRIGHT TIN BRIGHTENERS - Datasheets
Both Cerambus’ matte and bright tin brighteners produce dense, highly level deposits that serve as an excellent etch resist. Both the matte and bright brighteners are typically used in sulfuric based baths, which are much less expensive to operate than fluoroboric or methane sulfonic acid based systems.

BEETLEPLATE® WF50 WHITE TIN - Datasheet
Beetleplate® WF50 White Tin is a high build immersion tin plating solution. It will produce a dense, solderable, coplanar and whisker free deposit of tin on copper surfaces. The bath can be used as a final finish, and is a direct replacement for hot air solder leveling (HASL). This tin coating, with a 1 micron (40 microinch) thickness, will maintain solderability for up to a year. A key advantage to this formulation is that it will not attack soldermasks, as many competitive products do.

 

 Home